MIJING 50g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:

• 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair

• Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store

• Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force

• Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution

• Meet the maintenance needs of motherboards for Huawei and Apple high-end machines

Package includes:

• 1 x Tin Paste