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Relife RL-404S 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:

  • RL-404S 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair

  • Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store

  • Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force

  • Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution

  • Meet the maintenance needs of motherboards for Huawei and Apple high-end machines


Package includes:

  • 1 x Tin Paste